Teledyne Scientific & Imaging is a leader in providing enabling technologies for industrial growth markets. They are seeking a Hybridization Engineer to join their mission-focused team, where responsibilities include determining tooling and conditions for various processes and optimizing production designs.
Responsibilities
- Determine tooling and conditions for various processes, including etching, flip-chip bonding, polishing, and AR coating
- Review components and assembly designs to optimize production
- Track key process controls and measurements needed to verify success and meet assembly specifications
Skills
- Knowledge of flip-chip bonding and assembly processes, including epoxy bonding, polishing, substrate removal and AR coating
- Strong background in opto-electronic semiconductor devices or similar area of knowledge
- Experience in DOE, product and technology development
- Strong technical writing and communication skills are required to complete whitepapers, proposals, technical reports, and support customer reviews
- Computer proficiency using Microsoft Office Suite (Word, Excel & PowerPoint)
- Bachelor's or Master's Degree with one (1) to three (3) years of experience; or equivalent combination of education and experience
- U.S. Citizenship due to access restrictions
Benefits
- Health, Dental, Vision, and Life Insurance from Day 1
- Paid Vacation, Sick Time, and Holidays
- 401(k) with Company Match
- Employee Stock Purchase Plan
- Educational Tuition Reimbursement
- Fun Employee Events throughout the year
Company Overview
Apply Now